Capability

Component Capabilities：

• Solder Paste Printing
• SMT (BGA, uBGA, PoP and 01005)
BGA/CSP/CBGA/CCGA/PGA Down To 140 Micron Pitch
• COB, PoP, Multichip, Chip on FPC
• Soldering & Flip Chip with Die Size of 0.5~50mm

Manufacturing Capabilities

• Electronic Assembly
• Complete Device Assembly
• System Build/System Integration/Programming
• Process Design & Optimization
• Conformal Coating (UV-Curable)
• Chip Underfill/Corner Bonding
• Material Handling
• Component Traceability
• Test & Validation
• FEMA System (PFMEA)
• DFM/DFA

Testing Capabilities

• Circuit/Functional Test
• Boundary Scan
• Flying Probe
• 2D/3D AOI, AXI,2D/3D X-Ray
• ATE, DFT, RF, HASS,Burn In,ESD Check

Service Capabilities

Europlacer 錫膏印刷機 — Europlacer solder paste printing machine

• JDM (Join Design Manufacturing)
• Prototype
• NPI/MP
• Low Volume/High Mix
• Logistic
• Turnkey/Sourcing
• RMA

Equipment Capabilities

PRODUCTION EQUIPMENT

Mounting Machine、High Speed Machine、Multi-Function Mounter、Die/Wire Bonding、Underfill/Glop Top Machine、Reflow Machine、Soldering Machine、Routing Machine、Ultrasonic Machine、Press Fit Machine

TEST EQUIPMENT

PCB Appearance Check Machine、Solder Paste Thickness Tester、3D SPI/AOI/ICT/X-Ray、FAI Tester、Flying Probe、Boundary Scan

RELIABILITY EQUIPMENT

Burn In Room、Salt Spray Tester、Integrating Sphere、Temperature & Humidity Chamber、Vibration Tester、Thermal Shock、Drop Tester、ESD imulator